From 868926ae2a0835426c155588177912651edffd58 Mon Sep 17 00:00:00 2001 From: duangavin123 Date: Wed, 26 Jan 2022 07:12:37 +0000 Subject: [PATCH] update zh-cn/device-dev/subsystems/subsys-build-standard-large.md. Signed-off-by: duangavin123 --- zh-cn/device-dev/subsystems/subsys-build-standard-large.md | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-) diff --git a/zh-cn/device-dev/subsystems/subsys-build-standard-large.md b/zh-cn/device-dev/subsystems/subsys-build-standard-large.md index 59d6b22ec1f..cd1f3d3bf77 100644 --- a/zh-cn/device-dev/subsystems/subsys-build-standard-large.md +++ b/zh-cn/device-dev/subsystems/subsys-build-standard-large.md @@ -17,7 +17,7 @@ - 构建不同芯片平台的产品。如:Hi3516DV300平台。 -- 根据产品配置可以按照组件组装打包产品需要的能力。 +- 根据产品配置,按照组件组装打包产品需要的能力。 ### 基本概念 -- Gitee